发明名称 SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device capable of excellently discharging the heat of a semiconductor light emitting element from a supporting plate to the outside and being planarly mounted and uprightly mounted. <P>SOLUTION: The semiconductor light emitting device is provided with a metallic supporting plate (1), the semiconductor light emitting element (2) fixed to the supporting plate (1), a wiring conductor (4) arranged through an insulator (6) from the upper surface (13) of the supporting plate (1) to an outer side face (12), and a resin coating body (3) covering the outer side face (12) and the wiring conductor (4). Since the supporting plate (1) is provided with a projection part (16) projected from the outer side face (12) to the outer side and exposed to the outside from a notched part (3a) formed on the resin coating body (3), the heat of the semiconductor light emitting element (2) is excellently discharged to the outside. Also, plane mounting is performed by connecting the bottom surface (14) of the supporting plate (1) and the other end (4d) of the wiring conductor (4) to a circuit board, and upright mounting is performed by connecting the projection part (16) of the supporting plate (1) and the other end (4d) of the wiring conductor (4) to the circuit board. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004296882(A) 申请公布日期 2004.10.21
申请号 JP20030088665 申请日期 2003.03.27
申请人 SANKEN ELECTRIC CO LTD 发明人 TSUKAGOSHI KOJI
分类号 H01L33/56;H01L27/15;H01L29/26;H01L29/267;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/56
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