| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in resistance to soldering in molding into a non-copper frame, and a semiconductor device. SOLUTION: The epoxy resin composition for sealing semiconductors comprises (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a dithiol compound represented by formula (1) (wherein R is a 4-17C alkyl chain or a hydrocarbon chain containing an aromatic ring). COPYRIGHT: (C)2005,JPO&NCIPI |
