| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer wiring board wherein position deviation is not generated in a laminating process of a wiring board. SOLUTION: In the method for manufacturing the multilayer wiring board, a through-hole is formed in a plurality of wiring board superposed heated and pressed in the state of forming a holding section for preventing position deviation made of liquid resin in the through hole. The plurality of the wiring boards superposed is fixed in the XY plate direction by filling the through-hole with the liquid resin without any gap and hardening. COPYRIGHT: (C)2005,JPO&NCIPI |
