| 摘要 |
PROBLEM TO BE SOLVED: To carry out mutual correction using a laser processing device and an aligner in a laser processing process and an exposure process for forming inter-layer connection in a multilayer circuit wiring structure to improve the accuracy of interlayer connection positions. SOLUTION: A multilayer circuit wiring board is formed by sequentially laminating circuit wiring pattern layers on a center circuit wiring board via insulating layers in such a way that at least one or more types of a plurality of reference marks of specific shapes are formed near the outer periphery of a circuit wiring pattern area, and the circuit wiring pattern layers are formed within the circuit wiring pattern area on the center circuit wiring board. In carrying out the alignment of a vertical interwiring position and an interlayer connection position in a manufacturing process for the multilayer circuit wiring board, an angle offset amount is corrected by the exposure system with a reference position given by the reference A marks for the interlayer connection position, and by a hole forming device with a reference position given by the reference B marks for an underlayer circuit wiring pattern at the vertical interwiring position. COPYRIGHT: (C)2005,JPO&NCIPI |
