| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem wherein chipping of a material and breakage of a structure occur due to stress and abrasive grains at the time of processing, when a brittle material is subjected to processing. SOLUTION: A method of processing a brittle material comprises steps of: the repeated process of filling a groove part formed by a first processing with a curable filler and executing a second processing after curing, followed by removing the curable filler finally; applying surface treatment such as deposition and plating upon an object to be processed, and thereafter removing the curable filler; and further bonding a protective substrate to the surface of the brittle material, and removing the protective substrate after processing, wherein a cyanoacrylate is used as the curable filler and the curable adhesive agent. COPYRIGHT: (C)2005,JPO&NCIPI |
