| 摘要 |
PROBLEM TO BE SOLVED: To prevent a relative positional deviation between a semiconductor module and a cooling tube when a semiconductor device is assembled. SOLUTION: In the semiconductor device, there are pinched a plurality of semiconductor modules 10 having a main body, one end terminals 15, 17, and the other end terminal 19 projecting from one end side and/or the other end side respectively, between a primary cooling tube 25 having a medium circulation space and a secondary cooling tube 45. The main body sticks to the primary cooling tube and the secondary cooling tube. At one side edge of the primary cooling tube and one side edge of the secondary cooling tube, there is formed one side positioning portion 30 engaging with one end surface of the semiconductor module. At the other side edge of the primary cooling tube and the other side edge of the secondary cooling tube, there is formed the other side positioning portion 60 engaging with the other end surface of the semiconductor module. COPYRIGHT: (C)2005,JPO&NCIPI
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