发明名称 |
CERAMIC LAMINATED ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic laminated electronic component having a via hole of high connection reliability. SOLUTION: The ceramic laminated electronic component having a conic via hole electrode inside is characterized in that the via hole electrode is sectioned nearly in a trapezoidal shape and has a diameter up to 0.9 to 1.6 times and down to 0.7 to 1.3 times as large as the thickness of a ceramic sheet forming the via hole electrode. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004296992(A) |
申请公布日期 |
2004.10.21 |
申请号 |
JP20030090477 |
申请日期 |
2003.03.28 |
申请人 |
HITACHI METALS LTD |
发明人 |
KURIHARA KOICHIRO;AZUMAGUCHI MITSUHIRO |
分类号 |
H01F17/00;H01F27/29;(IPC1-7):H01F27/29 |
主分类号 |
H01F17/00 |
代理机构 |
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