发明名称 CERAMIC LAMINATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a ceramic laminated electronic component having a via hole of high connection reliability. SOLUTION: The ceramic laminated electronic component having a conic via hole electrode inside is characterized in that the via hole electrode is sectioned nearly in a trapezoidal shape and has a diameter up to 0.9 to 1.6 times and down to 0.7 to 1.3 times as large as the thickness of a ceramic sheet forming the via hole electrode. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004296992(A) 申请公布日期 2004.10.21
申请号 JP20030090477 申请日期 2003.03.28
申请人 HITACHI METALS LTD 发明人 KURIHARA KOICHIRO;AZUMAGUCHI MITSUHIRO
分类号 H01F17/00;H01F27/29;(IPC1-7):H01F27/29 主分类号 H01F17/00
代理机构 代理人
主权项
地址