ETCHING APPARATUS AND METHOD OF SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an etching apparatus to surely realize the etching of only the circumferential edge of a semiconductor wafer. SOLUTION: The etching apparatus comprises a holding and driving mechanism 1 to drive a semiconductor wafer to rotate in the circumferential direction by vertically holding the wafer, and an etching vessel 21 to contain etchant and etch the circumferential edge of the semiconductor wafer to be driven to rotate with the holding and driving mechanism by soaking the wafer into the etchant. COPYRIGHT: (C)2005,JPO&NCIPI