| 摘要 |
PROBLEM TO BE SOLVED: To provide a packaging apparatus for surely compensating for displacement on a carrier tape of chips generated at the time of packaging. SOLUTION: The packaging apparatus comprises a bonding stage 12 for supplying the carrier tape 13, a bonding tool 11 for packaging chips 21 with pressure to the carrier tape, displacement measuring sensors 27, 28 for directly or indirectly detecting displacement of chips on the carrier tape when the chips are packaged with pressure to the carrier tape using the bonding tool, and driving sources 3, 5 for driving in the direction opposite to the displacement, the bonding tool or bonding stage on the carrier tape on the basis of detection with the displacement measuring sensor. COPYRIGHT: (C)2005,JPO&NCIPI
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