| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-dissipating sheet in which handling properties are improved with a high flexibility and a high thermal conductivity regarding the heat-dissipating sheet disposed to an electronic part such as an integrated circuit and efficiently dissipating a heat generation from the electronic part. SOLUTION: In the heat-dissipating sheet having a two-layer structure in which a thermal conductive material is bonded by a bonding agent, a hardness difference between the Askar C hardness of one layer and that of the other layer ranges from 21 to 50. COPYRIGHT: (C)2005,JPO&NCIPI
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