发明名称 HIGH CONDUCTIVITY INKS WITH LOW MINIMUM CURING TEMPERATURES
摘要 Conductive ink compositions which can be cured to highly conductive metal traces by means of "chemical welding" include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.
申请公布号 WO2004067647(A3) 申请公布日期 2004.10.21
申请号 WO2004US02313 申请日期 2004.01.27
申请人 PARELEC INC. 发明人 CONAGHAN, BRIAN, F.;KYDD, PAUL, H.;RICHARD, DAVID, L.
分类号 C09D11/00;H01B1/22;H05K1/09 主分类号 C09D11/00
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