发明名称 |
HIGH CONDUCTIVITY INKS WITH LOW MINIMUM CURING TEMPERATURES |
摘要 |
Conductive ink compositions which can be cured to highly conductive metal traces by means of "chemical welding" include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures. |
申请公布号 |
WO2004067647(A3) |
申请公布日期 |
2004.10.21 |
申请号 |
WO2004US02313 |
申请日期 |
2004.01.27 |
申请人 |
PARELEC INC. |
发明人 |
CONAGHAN, BRIAN, F.;KYDD, PAUL, H.;RICHARD, DAVID, L. |
分类号 |
C09D11/00;H01B1/22;H05K1/09 |
主分类号 |
C09D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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