摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing apparatus for obtaining a substrate treating or to be treated having less contamination by protecting a metallic member such as a lower case or a cover forming a part of a chamber of a plasma treatment reaction chamber, i.e. a vacuum container, from plasma. SOLUTION: The plasma treatment apparatus applies plasma treatment to a substrate 6 to be treated in a chamber (vacuum container 10) having a metallic chamber wall (such as the lower container 1, the cover 7 frame) as at lease one part. In this apparatus, at least an insulating protective member 8 is provided on the side of a vacuum seal surface between the metallic chamber wall (such as the lower container 1, cover 7 frame) and the other chamber wall (such as a upper container 2). COPYRIGHT: (C)2005,JPO&NCIPI
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