| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide abrasive agent, by which polishing can be effectively performed evenly, easily, at a high speed and independent of a polishing apparatus; a polishing method; and a manufacturing method of electronic parts obtained by the abrasive agent and the manufacturing method in a CMP technique for flattening an interlayer insulating film, a BPSG film, and an insulating film for shallow trench isolation. <P>SOLUTION: This abrasive agent includes a cerium oxide particle, a dispersant, an addition agent and water, and a surface tension of the abrasive agent is not more than 45 dyn/cm. Preferably, as the addition agent, a first addition agent for reducing the surface tension and a second addition agent for improving surface smoothness are included. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
