发明名称 |
Semiconductor package and production method |
摘要 |
A plurality of semiconductor packages is collectively fabricated on a wafer in a batch process and the wafer is then diced to obtain discrete semiconductor packages. The semiconductor package is a stacked body formed by bonding two or more semiconductor devices. Each semiconductor device comprises a substrate and a device pattern formed on a surface of the substrate. The semiconductor devices are stacked in such a fashion that a device pattern surface of the lower semiconductor device faces a non-device pattern surface of the semiconductor device stacked on the same.
|
申请公布号 |
US2004207082(A1) |
申请公布日期 |
2004.10.21 |
申请号 |
US20040821915 |
申请日期 |
2004.04.12 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
YAMANO TAKAHARU;YOSHIHARA TAKAKO;SUNOHARA MASAHIRO |
分类号 |
H01L25/18;H01L23/31;H01L23/367;H01L23/485;H01L25/065;H01L25/07;(IPC1-7):H01L23/48 |
主分类号 |
H01L25/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|