发明名称 Temperature compensation for silicon MEMS resonator
摘要 Thermally induced frequency variations in a micromechanical resonator are actively or passively mitigated by application of a compensating stiffness, or a compressive/tensile strain. Various composition materials may be selected according to their thermal expansion coefficient and used to form resonator components on a substrate. When exposed to temperature variations, the relative expansion of these composition materials creates a compensating stiffness, or a compressive/tensile strain.
申请公布号 US2004207489(A1) 申请公布日期 2004.10.21
申请号 US20030414793 申请日期 2003.04.16
申请人 发明人 LUTZ MARKUS;PARTRIDGE AARON
分类号 H01P7/10;H03H;H03H9/00;H03H9/02;H03H9/24;H03H9/50;H03H9/54;(IPC1-7):H03H9/54 主分类号 H01P7/10
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