| 发明名称 |
METHOD OF MANUFACTURING A REINFORCED SEMICONDUCTOR WAFER |
| 摘要 |
The invention concerns a method of manufacturing a slice of semiconductor. The slice of semiconductor comprises an active face and an inactive face. A passivation layer (pass) is deposited on the active face. The method comprises an organic-layer-depositing step, in which an organic layer (ORGA1) is deposited on the inactive face of slice of semiconductor. |
| 申请公布号 |
WO2004073062(A3) |
申请公布日期 |
2004.10.21 |
| 申请号 |
WO2004IB00335 |
申请日期 |
2004.02.10 |
| 申请人 |
AXALTO SA;SCHLUMBERGER MALCO, INC;AUDOUX, JEAN-NOEL;GROENINCK, DENIS |
发明人 |
AUDOUX, JEAN-NOEL;GROENINCK, DENIS |
| 分类号 |
H01L21/56;H01L23/00;H01L23/31 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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