| 摘要 |
<P>PROBLEM TO BE SOLVED: To correctly execute an alignment even when a target position detecting mark can not be detected or even when the mark can not be measured due to damage of a signal of alignment caused by wafer processing. <P>SOLUTION: A plurality of alignment marks L1, M1, N1, O1, P1 of similar shapes are present in a visual field, auxiliary patterns CPa, CPb, CPc, CPd are added in the region including the marks, and the target position detecting mark is extracted from the plurality of alignment marks present in the visual field by shape and arrangement of the auxiliary patterns. When the target position detecting mark can not be extracted due to signal deterioration or the like, the position of the target position detecting mark is judged from a plurality of peripheral marks. When the target position detecting mark can not be measured, other mark is changed to the target position detecting mark. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
