| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has developing property enabling formation of a fine image, which is used for a flexible printed board, and which is suitable for a photosensitive solder resist or a protective film to be used for a re-wiring layer on a wafer. <P>SOLUTION: The photosensitive resin composition contains a polyimide-ester resin (A) having 1,000 to 20,000 number average molecular weight as the resin main component and a photopolymerization initiator compounded in the resin. The resin (A) is prepared by the reaction of: siloxanediamine; polyimide or its precursor produced from an aromatic tetracarboxylic acid anhydride and having a carboxyl group or an acid anhydride group as the end group; and (1) an unsaturated dihydroxy compound having each two of polymerizable unsaturated double bonds and hydroxyl groups, or (2) the above unsaturated dihydroxy compound and a dihydroxy compound having no polymerizable unsaturated double bond. The equivalent of the polymerizable unsaturated double bonds in the whole resin solid content (the whole resin solid content (g)/polymerizable unsaturated double bonds (mol)) ranges 650 to 800. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
