| 摘要 |
PROBLEM TO BE SOLVED: To enable direct measurement of adhesion ability of each bonding terminal member after real mounting on a mounting substrate, regarding a testing method of a bonding terminal member and a testing apparatus of a bonding terminal member. SOLUTION: A stress generating plate 3 is made to face an electronic component 1 to which a bonding terminal members 2 are bonded with a gap. Measurement pins 5 are heated and bonded to the bonding terminal members 2 through apertures arranged on the stress generating plate 3. At least one of adhesion strength and electrical property of the bonding terminal members 2 is measured in the state of bonding. COPYRIGHT: (C)2005,JPO&NCIPI
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