| 摘要 |
PROBLEM TO BE SOLVED: To provide technique conducting flat patterning with no unevenness generating in etching or the like, to provide a device capable of uniformly working in a large area, and to provide a method reducing a cost by reducing the number of processes, enhancing a yield, and improving environment in one breath. SOLUTION: In a first process, by oxygen ion irradiation, the cleaning and oxidation of the surface are advanced, a work function is increased, a hole injection efficiency is increased, and as a result, the process becomes a brightness increasing process, and in a second process, electron beams are irradiated, the work function is decreased, and brightness is extremely decreased. By previously forming a pattern with a metal mask or the like before irradiation, and then conducting irradiation, patterning is made possible without using an etching process. COPYRIGHT: (C)2005,JPO&NCIPI
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