发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, LASER IRRADIATION METHOD, AND LASER IRRADIATION DEVICE
摘要 PROBLEM TO BE SOLVED: To solve the problem wherein a semiconductor device having high characteristics can be expected when a semiconductor film is subjected to annealing by using a continuous oscillation laser, but when the semiconductor film is scanned with a beam having an elliptical shape in cross section, the area ratio of a region of bad crystallinity to the whole film becomes high and causes a trouble when increasing the integration of the semiconductor device. SOLUTION: The semiconductor film as an object of irradiation is irradiated with harmonic waves emitted from a continuous oscillation laser and fundamental waves of wavelength 1μm or so in an auxiliary manner at the same time. A region of the semiconductor film which is less given the energy of the harmonic waves is more given the energy of fundamental waves, and the other region of the semiconductor film which is more given the energy of the harmonic waves is less given the energy of fundamental waves. By this setup, a long crystal grain region can be formed in the semiconductor film restraining a region of bad crystallinity from being formed. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004297055(A) 申请公布日期 2004.10.21
申请号 JP20040064873 申请日期 2004.03.08
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 TANAKA KOICHIRO;OISHI HIROMASA;YAMAZAKI SHUNPEI
分类号 H01L21/20;H01L21/268;H01L21/336;H01L29/786;(IPC1-7):H01L21/268 主分类号 H01L21/20
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