METHOD AND DEVICE FOR APPLYING ADHESIVE

摘要

PROBLEM TO BE SOLVED: To improve a production efficiency of an electronic circuit board in a variety of aspects without jumboizing a device. SOLUTION: A plurality of applicators 22, 23 having the identical application diameter are used in order to automatically apply an adhesive to a required position of an object 1 to which the adhesive is applied with application heads 7, 8 which can select and use a plurality of applicators 25-27 according to a predetermined program. The applicators 22, 23 having the identical application diameter are alternately used so that the number of uses within a range of specific units becomes identical among the applicators by making use of information of the program. COPYRIGHT: (C)2005,JPO&NCIPI