METHOD TO DEPOSIT AN IMPERMEABLE FILM ONTO A POROUS LOW-K DIELECTRIC FILM

摘要

A method for improving the adhesion of an impermeable film on a device such as porous low-k dielectric film in an interconnect structure is disclosed. The method provides an in-situ annealing step before the deposition of the impermeable film to release the volatile trapped or adsorbed molecules such as water, alcohol, HCl, HF vapor, of the porous low-k dielectric film. The method also provides in-situ deposition of the impermeable film following the deposition of the porous low dielectric film without exposure to an atmosphere containing trappable molecules. The method further provides in-situ deposition of the impermeable film following the removal a portion of the porous low-k dielectric film without exposure to an atmosphere containing trappable molecules