| 摘要 |
A wiring board comprising a wiring part consisting of one or more wiring layers, a first terminal part projecting from one side of the wiring part, and a second terminal part provided on the other side of the wiring part. Resist having an opening for the first terminal part is formed on the surface of a composite material consisting of multiple metal layers, and only the first metal layer of the composite material is etched from the opening for the first terminal part thus forming a hole part. Inside of the hole part is subjected to electrolytic plating from the opening of the resist and the hole part is filled with the electrolytic plating layer thus forming a first terminal part. Subsequently, the resist is removed, a wiring layer is provided on the composite material, and solder resist having an opening for the second terminal part is provided on the wiring layer. The opening for the second terminal part in the solder resist is subjected to electroplating thus forming the second terminal part. Finally, the remaining part of the composite material is removed thus producing the wiring board. |
