发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 Through holes (36E) for ground and through holes (36P) for power supply are arranged in a lattice form on a core board (30) so that electromotive forces induced in the X direction and the Y direction are canceled. Mutual inductance is thereby decreased and an erroneous operation and an error are prevented even if a high frequency IC chip is mounted. Consequently, electrical characteristics and reliability can be enhanced.
申请公布号 WO2004091268(A1) 申请公布日期 2004.10.21
申请号 WO2004JP04977 申请日期 2004.04.06
申请人 IBIDEN CO., LTD.;KATO, SHINOBU 发明人 KATO, SHINOBU
分类号 H01L23/498;H01L23/50;H05K3/42;H05K3/46 主分类号 H01L23/498
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