发明名称 |
MULTILAYER PRINTED WIRING BOARD |
摘要 |
Through holes (36E) for ground and through holes (36P) for power supply are arranged in a lattice form on a core board (30) so that electromotive forces induced in the X direction and the Y direction are canceled. Mutual inductance is thereby decreased and an erroneous operation and an error are prevented even if a high frequency IC chip is mounted. Consequently, electrical characteristics and reliability can be enhanced. |
申请公布号 |
WO2004091268(A1) |
申请公布日期 |
2004.10.21 |
申请号 |
WO2004JP04977 |
申请日期 |
2004.04.06 |
申请人 |
IBIDEN CO., LTD.;KATO, SHINOBU |
发明人 |
KATO, SHINOBU |
分类号 |
H01L23/498;H01L23/50;H05K3/42;H05K3/46 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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