发明名称 METHODS FOR FORMING AND JOINING GLASS THIN FILM
摘要 PROBLEM TO BE SOLVED: To prevent a glass target from being damaged even at high output in sputtering; and to suppress that the concentration of a sodium compound in the glass becomes high in positive electrode ligation. SOLUTION: A low melting glass film 2 is formed by applying a low melting glass material on one surface of a first glass substrate 1 by a silk-screen printing method, and then the materials are fired. Subsequently, a low melting glass thin film 5 is formed on a second glass substrate 4 to be coated with a coating by performing sputtering by using the low melting glass film 2 fired as the target. Further, a voltage is impressed between a silicon substrate 6 and the second glass substrate 4 while bringing the low melting glass thin film 5 into contact with the silicon substrate 6. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004292259(A) 申请公布日期 2004.10.21
申请号 JP20030088312 申请日期 2003.03.27
申请人 CASIO COMPUT CO LTD 发明人 TERASAKI TSUTOMU;TAKEYAMA HIROYUKI
分类号 C03C17/02;C03C27/02;C23C14/10;(IPC1-7):C03C17/02 主分类号 C03C17/02
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