SOLID STATE IMAGING DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To prevent the extrusion of an adhesive when a spacer is pasted to a chip substrate. SOLUTION: A chamfered part 5b is formed at the edge of the pasting end face 5a of a spacer 5 disposed to surround a solid state image sensor 3 formed on the upper surface of a solid state image sensor chip 4. The chamfered part 5b can be formed easily with high precision by performing isotropic dry etching before the spacer 5 is formed by anisotropic dry etching. Even if an adhesive 10 extrudes when the spacer 5 is pasted to a chip substrate 4a, it is received in the chamfered part 5b and does not flow to the solid state image sensor 3. COPYRIGHT: (C)2005,JPO&NCIPI