发明名称 |
Reflow soldering process for electronic circuit boards has a microwave powered preheating stage |
摘要 |
<p>The electronic circuit boards [20] are continuously transferred on a conveyor [24] through the reflow soldering process [10]. The circuit boards are prewarmed by passing under a microwave heating stage [18] having a controlled frequency. The heated circuits then pass to the soldering stage [14] and finally to a cooling stage [16].</p> |
申请公布号 |
DE10316513(A1) |
申请公布日期 |
2004.10.21 |
申请号 |
DE2003116513 |
申请日期 |
2003.04.09 |
申请人 |
ENDRESS + HAUSER GMBH + CO. KG |
发明人 |
BIRGEL, DIETMAR |
分类号 |
H05B6/78;H05K3/34;(IPC1-7):B23K3/04;H05B6/64 |
主分类号 |
H05B6/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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