发明名称 Reflow soldering process for electronic circuit boards has a microwave powered preheating stage
摘要 <p>The electronic circuit boards [20] are continuously transferred on a conveyor [24] through the reflow soldering process [10]. The circuit boards are prewarmed by passing under a microwave heating stage [18] having a controlled frequency. The heated circuits then pass to the soldering stage [14] and finally to a cooling stage [16].</p>
申请公布号 DE10316513(A1) 申请公布日期 2004.10.21
申请号 DE2003116513 申请日期 2003.04.09
申请人 ENDRESS + HAUSER GMBH + CO. KG 发明人 BIRGEL, DIETMAR
分类号 H05B6/78;H05K3/34;(IPC1-7):B23K3/04;H05B6/64 主分类号 H05B6/78
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