| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a low temperature fired multilayer ceramic wiring board having high dimensional precision attained even by firing a green sheet laminated body in a continuous firing furnace. <P>SOLUTION: When the heat capacity of a tray 6 per unit surface area is expressed by M and the heat capacity of the low temperature fired multilayer ceramic wiring board to be obtained per unit surface is expressed by (m), the relation of M≤4m is satisfied. When the thickness of the tray is expressed by T and the thickness of the low temperature fired multilayer ceramic wiring board is expressed by (t), the relation of t≤T≤6t is satisfied. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
