| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase an interval between laminated semiconductor chips while suppressing the increase of the number of processes. <P>SOLUTION: A semiconductor chip 5a is mounted on a semiconductor chip 4a so as to be faced up through insulating resin 6 with which particles 7 are mixed, and the size of the particles 7 mixed with the insulating resin 6 is set so that an interval between semiconductor chips 4a and 5a can be held by the particles 7 themselves. Thus, a conductive wire 4d connected to the semiconductor chip 4a can be prevented from being brought into contact with the semiconductor chip 5a. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
