TERMINAL ELECTRODE, SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC APPARATUS, METHOD FOR MAKING TERMINAL ELECTRODE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
摘要
<P>PROBLEM TO BE SOLVED: To capture ACF particles efficiently on a bump electrode when the bump electrode is bonded through an anisotropic conductive layer. <P>SOLUTION: An opening part 5 is formed on a pad electrode 2 by exposing and developing a photosensitive resin layer 4. A conductive layer 6 connected with the pad electrode 2 is formed in the opening part 5 up to an intermediate height using electroless plating thus providing a level difference between the photosensitive resin layer 4 and the conductive layer 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI
