| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable a semiconductor device, especially such as a power amplifier module or the like, to be improved in reliability. <P>SOLUTION: The semiconductor device is composed of a module substrate 4 provided with a main surface 4b and a back surface 4c, a lower chip 7 which is mounted on the main surface 4b of the module substrate 4 and equipped with a first circuit operating on a first frequency and a second circuit operating on a second frequency, an upper chip 2 which is arranged on the lower chip 7 and equipped with a first circuit and a second circuit, a plurality of wires 5 connecting the upper chip 2, the lower chip 7, and the module substrate 4 respectively together, and a plurality of chip parts 3 mounted on the module substrate 4. The first circuit of the upper chip 2 and the second circuit of the lower chip 7 are arranged opposite to each other, and the second circuit of the upper chip 2 and the first circuit of the lower chip 7 are arranged opposite to each other, so that the upper and lower chip hardly interfere with each other through the wires on high-frequencies so as to improve the semiconductor device in reliability when the circuits operate on the frequencies, respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
