发明名称 |
Surface acoustic wave device and method of fabricating the same |
摘要 |
A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.
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申请公布号 |
US2004207485(A1) |
申请公布日期 |
2004.10.21 |
申请号 |
US20040809926 |
申请日期 |
2004.03.26 |
申请人 |
KAWACHI OSAMU;IKATA OSAMU;UEDA MASANORI;WARASHINA SUGURU |
发明人 |
KAWACHI OSAMU;IKATA OSAMU;UEDA MASANORI;WARASHINA SUGURU |
分类号 |
H03H9/25;H03H3/08;(IPC1-7):H03H9/72 |
主分类号 |
H03H9/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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