发明名称 Surface acoustic wave device and method of fabricating the same
摘要 A surface acoustic wave device includes a piezoelectric substrate having a first surface on which comb-like electrodes, first pads connected thereto, and a first film are provided. The first film is located so as to surround the comb-like electrodes. A base substrate has a second surface on which second pads joined to the first pads and a second film joined to the first film are provided. The first and second films joined by a surface activation process define a cavity in which the comb-like electrodes and the first and second pads are hermetically sealed.
申请公布号 US2004207485(A1) 申请公布日期 2004.10.21
申请号 US20040809926 申请日期 2004.03.26
申请人 KAWACHI OSAMU;IKATA OSAMU;UEDA MASANORI;WARASHINA SUGURU 发明人 KAWACHI OSAMU;IKATA OSAMU;UEDA MASANORI;WARASHINA SUGURU
分类号 H03H9/25;H03H3/08;(IPC1-7):H03H9/72 主分类号 H03H9/25
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