| 摘要 |
A pressurized chuck for semiconductor process and measurement equipment. The chuck is designed to eliminate backside wafer contamination. The pressurized chuck uses a combination of positive pressure under the wafer and clamps above the wafer edge. Wafers are held flat and stable. Preexisting particles on the wafer backside cause no problems with high spots. With a small modification, this chuck can provide an inert gas environment around the wafer.
|
