| 摘要 |
In the tape head polishing method of the present invention the tape head is moved orthogonally to the polishing medium (such as diamond polishing tape) direction of motion during polishing. The polishing medium motion is synchronized with the tape head motion, such that the polishing medium is held stationary when the tape head motion is stationary, and the polishing medium is moved when the tape head motion is approximately at a maximum velocity. The tape head velocity VH and the polishing medium velocity VT during the tape motion are generally related by the equation VT<=VH Tan phi, where Tan phi=W/L, where W is the width of an insulation layer fabricated between a magnetic shield and a tape head read sensor element, and L is the length of a read sensor element.
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