Modules having a plurality of contacts along edges thereof configured to conduct signals to the modules and further having a plurality of contacts along edges thereof configured to conduct signals from the modules

摘要

The present invention provides a module comprising a circuit board, a plurality of first contacts adjacent to an edge of the circuit board configured to conduct a plurality of signals to the module and a plurality of second contacts adjacent to the edge of the circuit board configured to receive the plurality of signals from the module to outside the module. Memory modules, sockets, circuit boards, and systems are also provided.