APPARATUS AND METHOD FOR FORMING FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for forming a film on a side wall inside a hole into an adequate thickness even for a miniaturized semiconductor device, to provide a film-forming method therefor, and to provide a method for manufacturing the semiconductor device with the use of the film-forming method. SOLUTION: This film-forming method includes depositing a film-forming material onto a substrate 5 while adding vibrations in a horizontal direction to the substrate 5, when forming the film inside the hole 21 formed on the substrate 5. COPYRIGHT: (C)2005,JPO&NCIPI