| 摘要 |
PROBLEM TO BE SOLVED: To provide a print slippage inspection method of a solder resist capable of inspecting easily the print misalignment quantity of the solder resist. SOLUTION: In a process for forming a circuit on a printed circuit board 1, reference patterns 41, 42, 42, 42, 43, 43, 43 are formed simultaneously on a preliminary plate part 1c. In a process for printing and applying the solder resist 3, non-resist patterns 51, 52, 52, 52, 53, 53, 53 are printed on the positions corresponding to the reference patterns 41, 42, 42, 42, 43, 43, 43, and the print misalignment quantity of the solder resist is inspected by the deviation between the reference patterns and the non-resist patterns. COPYRIGHT: (C)2005,JPO&NCIPI
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