发明名称 POLYAMIDE-IMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a material which is suitable for components of OA equipment and electronic equipment, having a stable surface resistivity in a semiconducting region, and is excellent in mechanical characteristics and dimensional characteristics. SOLUTION: This polyamide-imide resin composition is obtained by blending (A) a polyamide-imide resin, (B) carbon fibers, (C) glass fibers and/or glass beads, and (D) graphite, wherein the content of the resin (A), the total contents of the carbon fibers (B) and the constituent (C), and the content of the graphite (D) are 50-80 pts.wt., 50-20 pts.wt., and 1-10 pts.wt. respectively based on 100 pts.wt. total contents of the constituents (A), (B) and (C) and wherein the constituent (B) accounts for 30-70 wt.% of 100 wt.% total of the constituent (B) and the constituent (C). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004292597(A) 申请公布日期 2004.10.21
申请号 JP20030086255 申请日期 2003.03.26
申请人 TORAY IND INC 发明人 NAGANO HIROSHI;AKAIKE KATSUMI
分类号 C08L79/08;C08K3/04;C08K7/06;C08K7/14;C08K7/20;(IPC1-7):C08L79/08 主分类号 C08L79/08
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