发明名称 |
High power semiconductor module |
摘要 |
The stackable power semiconductor module comprises electrically conductive base plates, an electrically conductive cover plate and a plurality of semiconductor chips. The semiconductor chips are arranged in groups of several on separate base plates in preassembled submodules. The base plates are moveable towards the cover plate. The submodules are paralleled inside the module housing. The submodules are fully testable according to their current ratings. Altering the number of submodules paralleled inside the housing can vary the overall current rating of a module.
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申请公布号 |
US2004207070(A1) |
申请公布日期 |
2004.10.21 |
申请号 |
US20040479220 |
申请日期 |
2004.06.10 |
申请人 |
KAUFMANN STEFAN;LANG THOMAS;HERR EGON;NICOLA MAURO;GEKENIDIS SOTO |
发明人 |
KAUFMANN STEFAN;LANG THOMAS;HERR EGON;NICOLA MAURO;GEKENIDIS SOTO |
分类号 |
H01L25/00;H01L23/049;H01L25/07;H01L25/11;H01L25/18;H02M7/06;H02M7/12;(IPC1-7):H01L23/12 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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