发明名称 |
HEAT PUMP AND DEVICE USING HEAT |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat pump capable of improving the energy efficiency and miniaturizing a device even when a refrigerant needing high compression ratio such as the water is used. SOLUTION: This heat pump 1 comprises an evaporator 2, a compressor 3 and a condenser 4. The evaporator 2, the compressor 3 and the condenser 4 are arranged in line along the refrigerant flowing direction. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004293872(A) |
申请公布日期 |
2004.10.21 |
申请号 |
JP20030085247 |
申请日期 |
2003.03.26 |
申请人 |
TOKYO ELECTRIC POWER CO INC:THE |
发明人 |
WATANABE KENJI;SAKATA HIROYUKI;NISHIMURA HIROSHI;OKABE HARUMI |
分类号 |
F25B1/00;F25B1/10;F25B39/02;F25B39/04;(IPC1-7):F25B1/00 |
主分类号 |
F25B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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