发明名称 HEAT PUMP AND DEVICE USING HEAT
摘要 PROBLEM TO BE SOLVED: To provide a heat pump capable of improving the energy efficiency and miniaturizing a device even when a refrigerant needing high compression ratio such as the water is used. SOLUTION: This heat pump 1 comprises an evaporator 2, a compressor 3 and a condenser 4. The evaporator 2, the compressor 3 and the condenser 4 are arranged in line along the refrigerant flowing direction. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004293872(A) 申请公布日期 2004.10.21
申请号 JP20030085247 申请日期 2003.03.26
申请人 TOKYO ELECTRIC POWER CO INC:THE 发明人 WATANABE KENJI;SAKATA HIROYUKI;NISHIMURA HIROSHI;OKABE HARUMI
分类号 F25B1/00;F25B1/10;F25B39/02;F25B39/04;(IPC1-7):F25B1/00 主分类号 F25B1/00
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