CVD APPARATUS FOR FABRICATING IC TO CONTROL POLISHING DEGREE

摘要

PURPOSE: A CVD apparatus for fabricating an IC is provided to control a polishing degree of each part of a wafer by increasing or reducing a standby period of pad strips on the wafer. CONSTITUTION: A plate is used for fixing a semiconductor substrate. A polishing pad(320) includes a plurality of pad strips and is used for pressing the semiconductor substrate. A rotation unit(380) is used for rotating the polishing pad. A migration unit moves straightly a part of the pad strips. The polishing pad is formed with a circular shape. Each pad strip has a shape of a fan. The migration unit includes a motor(370), a screw(360) rotated by the motor, and a rod migrated by the rotation of the screw.