| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device of a semiconductor substrate and a method for polishing the semiconductor substrate using the same, in which it is possible to polish it at a stable polishing rate and to suitably process a fluid fed for polishing the semiconductor substrate. <P>SOLUTION: The polishing device of the semiconductor substrate comprises a platen 1 having a surface 1a, a polishing pad 2 which has a polishing surface 2a and is provided on the surface 1a to be rotated, a waste fluid recovering part 8 which is provided on the polishing pad 2 to remove the fluid fed onto the polishing surface 2a from the polishing surface 2a, and an outer peripheral step 4 which is provided in a fringe of the polishing surface 2a and has a top surface 4a. A height H1 from the surface 1a to the top surface 4a is greater than a height H3 from the surface 1a to the polishing surface 2a. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
