| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck which can attain a vacuum hermeticity of 1.3×10<SP>-10</SP>(Pa m<SP>3</SP>)/s even if a composite material having a porosity of 5-50% is joined to the ceramic electrostatic chuck. SOLUTION: The electrostatic chuck comprises an electrostatic attracting section which has a placement surface 7 for a wafer W which is one principal plane of a plate-like ceramic material 1 and has an electrode 2 on the other surface of or inside the plate-like ceramic material 1, and a plate 4 made of a composite material of SiC, Al, and Si which is joined to the surface opposite from the placement surface of the electrostatic attracting section via a metal bonding layer 3. The metal bonding layer 3 has a thickness of 10-200μm, and a rate of area occupied by Al in a surface of the plate 4 made of the composite material which is in contact with the metal bonding layer is 80% or less. COPYRIGHT: (C)2005,JPO&NCIPI |
