| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly heat conductive epoxy resin composition which surely fills the space between a circuit board and a semiconductor element in a semiconductor device, excels in productivity, and imparts high reliability to a joint. SOLUTION: The highly heat conductive epoxy resin composition comprises, as the essential components, (A) an epoxy resin containing≥80 wt.% glycidyl etherified epoxy resin obtained by mixing (a) a polyfunctional phenolic resin having a specific structure with (b) a phenol of a precursor of a crystalline epoxy resin having a specific structure at a weight ratio of (a) to (b) of 4-9 in the entire epoxy resin, (B) a phenolic resin curing agent containing≥80 wt.% polyfunctional phenolic resin curing agent having a specific structure in the entire phenolic resin curing agent, (C) a curing accelerator, and (D) alumina having two or more maximum points of the particle size distribution in 0.5μm to 12μm and a maximum particle diameter of≤24μm as an inorganic filler. COPYRIGHT: (C)2005,JPO&NCIPI
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