发明名称 Electrochemical cell
摘要 A tin coating is, for example, considered as a lead-free solder coating for a terminal attached to an electrochemical cell, but has presented a problem, as whiskers are likely to occur from the tin coating when the terminal is attached to the cell by laser welding. The formation of whiskers is due to the heat of laser welding and can be restrained by optimizing an undercoat layer of nickel or a nickel alloy.
申请公布号 US2004209163(A1) 申请公布日期 2004.10.21
申请号 US20040793288 申请日期 2004.03.04
申请人 WATANABE SHUNJI;KAITO TAKASHI;FUJII TOSHIAKI;IWASAKI KOUJI;WAKIYAMA SHIGERU 发明人 WATANABE SHUNJI;KAITO TAKASHI;FUJII TOSHIAKI;IWASAKI KOUJI;WAKIYAMA SHIGERU
分类号 H01G9/155;H01M2/30;H01M2/32;(IPC1-7):H01M2/30 主分类号 H01G9/155
代理机构 代理人
主权项
地址