发明名称 |
Semiconductor component for electrical coupling to a substrate, and method of manufacturing same |
摘要 |
A semiconductor component for electrical coupling to a substrate (230) includes: a semiconductor chip (110); a non-leaded leadframe (120) including a plurality of electrical contacts (130) located around a periphery (111) of the semiconductor chip; a first electrical conductor (140) electrically coupling together the semiconductor chip and the non-leaded leadframe; and a mold compound (210) disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts includes: a first surface (310) having a first surface area for electrically coupling to the semiconductor chip; and a second surface (320) opposite the first surface and having a second surface area for electrically coupling to the substrate, where the second surface area is larger than the first surface area.
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申请公布号 |
US2004207054(A1) |
申请公布日期 |
2004.10.21 |
申请号 |
US20030420054 |
申请日期 |
2003.04.21 |
申请人 |
MOTOROLA, INC. |
发明人 |
BROWN CLEM H.;CHOW WAI WONG;MOSNA FRANK J. |
分类号 |
G01N27/30;A61B5/00;A61B5/145;A61B5/1477;A61B5/1495;G01N27/416;H01L23/31;H01L23/495;(IPC1-7):H01L23/48;H01L21/48 |
主分类号 |
G01N27/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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