| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a large board for obtaining a plurality of wiring boards by which the occurrence of burr or chipping in dividing and breakage during handling in a mounting process is reduced. SOLUTION: The large board for obtaining a plurality of wiring boards is manufactured by a process of pressing the blade tip of a first blade into one main surface of a laminated body 1 obtained by laminating a plurality of ceramic green sheets to form a first V-shaped groove 2a, a process of pressing the blade tip of a second blade having a blade tip angleθ<SB>2</SB>smaller than the blade tip angleθ<SB>1</SB>of the first blade into one main surface of the laminated body 1 so as to cross with the first V-shaped groove 2a to form a second V-shaped groove 2b, and a process of sintering the laminated body 1 for forming the large board having the first and second V-shaped grooves 2a and 2b on the one main surface. COPYRIGHT: (C)2005,JPO&NCIPI
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