| 摘要 |
PROBLEM TO BE SOLVED: To prevent the degradation of hermeticity inside a package due to cracks in a brazing material when bonding an annular member on the top face of the standing wall of an input/output terminal set in an installation section of a frame, via the brazing material. SOLUTION: The package for housing a semiconductor element comprises a substrate 1 having a placement section 1a for a semiconductor element 5, the frame 2 which is so installed as to surround the placement part 1a and is formed with the installation section 2a for the input/output terminal 3, the input/output terminal 3 which consists of a flat part 3a wherein line conductors 3a-A are formed and the standing wall 3b bonded to a top face of the flat part 3a and is set in the installation section 2a, and the annular member 6 brazed to the top face of the frame 2 and of the input/output terminal 3. The standing wall part 3b has a difference in level between the top face thereof and a side face facing outside the frame 2. COPYRIGHT: (C)2005,JPO&NCIPI
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