| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser apparatus capable of further miniaturizing a package, improving positioning accuracy at the time of installation, and facilitating three-beam rotation adjustment. SOLUTION: The apparatus is provided with a substrate, a plurality of substrate supporting blocks each projecting from the substrate to the outside, and each of the plurality of substrate supporting blocks has an external peripheral surface which can be fitted into a round hole in cooperation with each other. A semiconductor laser element, a light-receiving element and an optical element for guiding a laser beam from the semiconductor laser element to an object and guiding a reflection beam of the object to the light-receiving element and a plurality of leads, are provided on the upper surface of a substrate. Base ends of the leads are electrically connected to the semiconductor laser element and the light-receiving element. Tip ends are extend from the end of the substrate, and bent and extend toward via a gap between at least two substrate supporting blocks. COPYRIGHT: (C)2005,JPO&NCIPI
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